Minah Lee

Architecture, Chip, and Package Codesign Flow for Interposer-Based 2.5-D Chiplet Integration Enabling Heterogeneous IP Reuse

Jinwoo Kim, Gauthaman Murali, Heechun Park et al. · IEEE Transactions on Very Large Scale Integration (VLSI) Systems · 2020 · 95 citations

Engineering, Computer Engineering, Computer Science +17

8.2 8Mb/s 28Mb/mJ robust true-random-number generator in 65nm CMOS based on differential ring oscillator with feedback resistors

Eunhwan Kim, Minah Lee, Jae‐Joon Kim · 2017 · 75 citations

Engineering, Computer Engineering, Electrical Engineering +17

Architecture, Chip, and Package Co-design Flow for 2.5D IC Design Enabling Heterogeneous IP Reuse

Jinwoo Kim, Gauthaman Murali, Heechun Park et al. · 2019 · 56 citations · Full text

Engineering, Computer Engineering, Computer Science +17

A three-dimensional high-throughput architecture using through-wafer optical interconnect

D.S. Wills, W.S. Lacy, C. Camperi-Ginestet et al. · Journal of Lightwave Technology · 1995 · 25 citations

Engineering, Computer Engineering, Electrical Engineering +17

Thin-film multimaterial optoelectronic integrated circuits

N.M. Jokerst, M.A. Brooke, O. Vendier et al. · IEEE Transactions on Components Packaging and Manufacturing Technology Part B · 1996 · 22 citations

Engineering, Electrical Engineering, Materials Science +17