W.S. Lacy

A three-dimensional high-throughput architecture using through-wafer optical interconnect

D.S. Wills, W.S. Lacy, C. Camperi-Ginestet et al. · Journal of Lightwave Technology · 1995 · 25 citations

Engineering, Device Integration, Computer Architecture +19

Processing architectures for smart pixel systems

D.S. Wills, W.S. Lacy, A. Lopez-Lagunas et al. · IEEE Journal of Selected Topics in Quantum Electronics · 1996 · 23 citations

Event Camera, Image Sensor, Image Analysis +13

High-throughput, low-memory applications on the Pica architecture

D.S. Wills, H.H. Cat, J.L. Cruz-Rivera et al. · IEEE Transactions on Parallel and Distributed Systems · 1997 · 16 citations

Hardware Security, Memory Architecture, Engineering +13

The offset cube: a three-dimensional multicomputer network topology using through-wafer optics

W.S. Lacy, J.L. Cruz-Rivera, D.S. Wills · IEEE Transactions on Parallel and Distributed Systems · 1998 · 14 citations

Engineering, Computer Architecture, Interconnection Network Architecture +20

A fine-grain, high-throughput architecture using through-wafer optical interconnect

W.S. Lacy, C. Camperi-Ginestet, B. Buchanan et al. · 2002 · 14 citations

Optical Materials, Engineering, Device Integration +21