24
Publications
654
Citations
15
H-Index
1993
Active since
Zhang Li is an author at Micron Corporation (United States) specializing in engineering, systems engineering, and electrical engineering.
Top concepts
EngineeringSystems EngineeringMaterial ScienceElectrical EngineeringHeat TransferMechanical EngineeringApplied PhysicsMicroelectronicsElectronic PackagingDesign
Publications per year
1993–2020
24
24
Further discussion on cloud manufacturing
Zhang Li, Cnr C · Computer Integrated Manufacturing Systems · 2011 · 148 citations
Warpage and Thermal Characterization of Fan-Out Wafer-Level Packaging
John H. Lau, Ming Li, Dewen Tian et al. · 2017 · 44 citations
Chip-First Fan-Out Panel-Level Packaging for Heterogeneous Integration
Cheng-Ta Ko, Chieh-Lin Chang, Jhih-Yuan Pan et al. · 2018 · 34 citations
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