Concepedia

Author

Junho Lee

Korea Advanced Institute of Science and TechnologyORCID

Also Known As

J. Lee, Jun-Ho LEE, Jun-Ho Lee, Jun-ho Lee, JunHo Lee, Junho Lee, Jun‐Ho Lee, Lee, Jun Ho, Lee, Jun-Ho

133

Publications

2.1K

Citations

23

H-Index

109

Concepts

All Affiliations

Korea Advanced Institute of Science and TechnologySK Group (United States)Inha UniversityKorea Institute of Machinery & MaterialsSamsung (South Korea)
JL

About

Junho Lee is an author at Korea Advanced Institute of Science and Technology specializing in engineering, electrical engineering, and applied physics.

Top Concepts

#ConceptH-IndexPublicationsCitations

1

Engineering

20

37

1.5K

2

Applied Physics

12

16

503

3

Chemical Engineering

3

3

40

4

Natural Sciences

2

2

114

5

Biomedical Engineering

1

1

14

Junho Lee

×

46

Publications

1.9K

Citations

23

H-Index

YearCitations

Visualization of asymmetric wetting ridges on soft solids with X-ray microscopy

Su Ji Park, Byung Mook Weon, Ji San Lee,

Nature Communications

2014

194

Water resistance and mechanical properties of biopolymer (alginate and soy protein) coated paperboards

Jong‐Whan Rhim, Junho Lee, Seok‐In Hong

LWT

2005

177

Modeling and Analysis of Through-Silicon Via (TSV) Noise Coupling and Suppression Using a Guard Ring

Jonghyun Cho, Eakhwan Song, Ki-Hyun Yoon,

IEEE Transactions on Components Packaging and Manufacturing Technology

2011

164

PDN Impedance Modeling and Analysis of 3D TSV IC by Using Proposed P/G TSV Array Model Based on Separated P/G TSV and Chip-PDN Models

Jun So Pak, Joohee Kim, Jonghyun Cho,

IEEE Transactions on Components Packaging and Manufacturing Technology

2011

128

Increase in water resistance of paperboard by coating with poly(lactide)

Jong‐Whan Rhim, Junho Lee, Seok‐In Hong

Packaging Technology and Science

2007

113

Modeling on the size dependent properties of InP quantum dots: a hybrid functional study

Eunseog Cho, Hyosook Jang, Junho Lee,

Nanotechnology

2013

84

Modeling and analysis of coupling between TSVs, metal, and RDL interconnects in TSV-based 3D IC with silicon interposer

Ki-Hyun Yoon, Gawon Kim, Woojin Lee,

2009

70

Mechanical and Water Barrier Properties of Soy Protein and Clay Mineral Composite Films

Jong‐Whan Rhim, Junho Lee, Hyo-Sup Kwak

Food Science and Biotechnology

2005

59

Modeling and Analysis of a Power Distribution Network in TSV-Based 3-D Memory IC Including P/G TSVs, On-Chip Decoupling Capacitors, and Silicon Substrate Effects

Kiyeong Kim, Chulsoon Hwang, Kyoungchoul Koo,

IEEE Transactions on Components Packaging and Manufacturing Technology

2012

57

High dielectric constant thin film EBG power/ground network for broad-band suppression of SSN and radiated emissions

Junho Lee, Hyung‐Soo Kim, Joungho Kim

IEEE Microwave and Wireless Components Letters

2005

56

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