Luc Guerin

Three-Dimensional Chip Stack With Integrated Decoupling Capacitors and Thru-Si Via Interconnects

Bing Dang, Michael A. Shapiro, Paul Andry et al. · IEEE Electron Device Letters · 2010 · 25 citations

Engineering, Computer Engineering, Electrical Engineering +17

Chip-to-package interaction for a 90 nm Cu / PECVD low-k technology

W. Landers, D. Edelstein, L. A. Clevenger et al. · 2004 · 25 citations

Engineering, Electrical Engineering, Materials Science +15

Miniature one-shot valve

Luc Guerin, Olivier Dubochet, J.-F. Zeberli et al. · 2002 · 23 citations · Full text

Engineering, Bioengineering, Biomedical Engineering +14

Bonding technologies for chip level and wafer level 3D integration

Katsuyuki Sakuma, Spyridon Skordas, Jeffrey A. Zitz et al. · 2014 · 15 citations

Engineering, Electrical Engineering, Materials Science +17

End-to-End Integration of a Multi-die Glass Interposer for System Scaling Applications

Brittany Hedrick, Vijay Sukumaran, Benjamin Fasano et al. · 2016 · 11 citations

Engineering, Manufacturing Engineering, Materials Engineering +17