Jeffrey A. Zitz - Concepedia

Author

Jeffrey A. Zitz

IBM (United States)

Also Known As

J. A. Zitz, J. Zitz, Jeffrey A. Zitz, Jeffrey Zitz

Publications

528

Citations

H-Index

Concepts

All Affiliations

IBM (United States)IBM (Germany)IBM Research - Austin IBM Research - Thomas J. Watson Research Center Williston State College

About

Jeffrey A. Zitz is an author at IBM (United States) specializing in engineering, microelectronics, and electronic packaging.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	7	7	458
2	Computer Engineering	6	6	447
3	Electrical Engineering	4	4	419
4	Applied Physics	1	1	15
5	Computer Science	1	1	13

Jeffrey A. Zitz

Publications

498

Citations

H-Index

Page 1

	Year	Citations
A Practical Implementation of Silicon Microchannel Coolers for High Power Chips E. G. Colgan, B. K. Furman, Michael Gaynes, IEEE Transactions on Components and Packaging Technologies EngineeringMicrochannel CoolerLiquid Metal CoolingIntegrated CircuitsAverage Power Densities	2007	241
A practical implementation of silicon microchannel coolers for high power chips E. G. Colgan, B. K. Furman, Michael Gaynes, Microchannel CoolerEngineeringLiquid Metal CoolingHeat PipeAverage Power Densities	2005	102
An advanced multichip module (MCM) for high-performance UNIX servers John Knickerbocker, Frank Pompeo, Asuka Tai, IBM Journal of Research and Development EngineeringComputer ArchitectureIntegrated CircuitsInterconnect (Integrated Circuits)Advanced Packaging (Semiconductors)	2002	46
Circuit and Physical Design of the zEnterprise™ EC12 Microprocessor Chips and Multi-Chip Module J. Warnock, Y.H. Chan, H. Harrer, IEEE Journal of Solid-State Circuits EngineeringVlsi DesignElectronic DesignPhysical DesignComputer Architecture	2013	30
4.1 22nm Next-generation IBM System z microprocessor J. Warnock, Brian Curran, John Badar,	2015	25
Bonding technologies for chip level and wafer level 3D integration Katsuyuki Sakuma, Spyridon Skordas, Jeffrey A. Zitz, EngineeringDevice IntegrationInterconnect (Integrated Circuits)Wafer Scale ProcessingAdvanced Packaging (Semiconductors)	2014	15
IBM Telum: a 16-Core 5+ GHz DCM Ofer Geva, Chris Berry, Robert Sonnelitter, 2022 IEEE International Solid- State Circuits Conference (ISSCC)	2022	15
Thermal and mechanical analysis and design of the IBM Power 775 water cooled supercomputing central electronics complex G. F. Goth, Amilcar Arvelo, Jason Eagle, EngineeringMechanical AnalysisEnergy EfficiencyLiquid Metal CoolingComputer Architecture	2012	13
Immersion cooling of a multichip module by pool boiling of FC-86. Jeffrey A. Zitz, Arthur E. Bergles EngineeringLiquid Metal CoolingMultichip ModuleCryogenicsThermal Management	1993	11

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