Concepedia

Frank Pompeo

FP

4

Publications

99

Citations

4

H-Index

2002

Active since

Affiliations

IBM (United States)(Current)

Frank Pompeo is an author at IBM (United States) specializing in electrical engineering, microelectronics, and engineering.

Top concepts

EngineeringMicroelectronicsElectronic PackagingElectrical EngineeringMicrofabricationComputer EngineeringHeat TransferMaterial ScienceAdvanced PackagingIntegrated Circuits

Publications per year

2002–2012

4

Publications

4

An advanced multichip module (MCM) for high-performance UNIX servers

John Knickerbocker, Frank Pompeo, Asuka Tai et al. · IBM Journal of Research and Development · 2002 · 46 citations

Engineering, Computer Architecture, Integrated Circuits +21

Differential heating/cooling chip joining method to prevent chip package interaction issue in large die with ultra low-k technology

Katsuyuki Sakuma, K L Smith, Krishna Tunga et al. · 2012 · 21 citations

Engineering, Ultra Low-k Technology, Mechanical Engineering +21

Phase change materials as a viable thermal interface material for high-power electronic applications

C. Ramaswamy, Subhash L. Shindé, Frank Pompeo et al. · 2004 · 18 citations

High-power Electronic Applications, Engineering, Thermal Conductivity +18

Advanced laminate carrier module warpage considerations for 32nm pb-free, FC PBGA package design and assembly

Edmund Blackshear, Thomas Lombardi, Frank Pompeo et al. · 2011 · 14 citations

Advanced Packaging, 3D Ic Architecture, Electrical Engineering +13

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