Robert Lo

How to select adhesive materials for temporary bonding and de-bonding of 200mm and 300mm thin-wafer handling for 3D IC integration?

Wei‐Chi Tsai, Hwan‐You Chang, Chi‐Hsien Chien et al. · 2011 · 58 citations

Engineering, Materials Engineering, Materials Science +17

Electromigration in Ni/Sn intermetallic micro bump joint for 3D IC chip stacking

Yu-Min Lin, Chau‐Jie Zhan, Jing-Ye Juang et al. · 2011 · 53 citations

Engineering, Electrical Engineering, Materials Science +16

Characterization and reliability assessment of solder microbumps and assembly for 3D IC integration

Ching-Kuan Lee, Tao‐Chih Chang, Yu-Jiau Huang et al. · 2011 · 40 citations

Engineering, Materials Engineering, Materials Science +15

Development of fluxless chip-on-wafer bonding process for 3DIC chip stacking with 30μm pitch lead-free solder micro bumps and reliability characterization

Chau‐Jie Zhan, Jing-Ye Juang, Yu-Min Lin et al. · 2011 · 36 citations

Engineering, Manufacturing Engineering, Microfabrication +14

Wafer Bumping, Assembly, and Reliability of Fine-Pitch Lead-Free Micro Solder Joints for 3-D IC Integration

Ching-Kuan Lee, Tao‐Chih Chang, John H. Lau et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2012 · 33 citations

Engineering, Materials Engineering, Materials Science +17