Tzu Nien Lee

High-Density Hybrid Substrate for Heterogeneous Integration

Tony Peng, John H. Lau, Cheng-Ta Ko et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2022 · 22 citations

Engineering, Materials Engineering, Materials Science +17

Fan-Out Panel-Level Packaging of Mini-LED RGB Display

John H. Lau, Cheng-Ta Ko, Curry Lin et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2021 · 18 citations

Engineering, Electrical Engineering, Materials Engineering +13

Development of High-Density Hybrid Substrate for Heterogeneous Integration

Chia-Yu Peng, John H. Lau, Cheng-Ta Ko et al. · 2021 · 16 citations

Engineering, Electrical Engineering, Materials Engineering +17

Electrolyte-Insulator-Semiconductor pH Sensors with Arrayed Patterns Manufactured by Nano Imprint Technology

Tzu Nien Lee, Henry J. H. Chen, Yo-Chen Huang et al. · Journal of The Electrochemical Society · 2018 · 13 citations

Engineering, Materials Engineering, Materials Science +16

Study on Sensing Properties of Ion-Sensitive Field-Effect-Transistors Fabricated With Stack Sensing Membranes

Tzu Nien Lee, Henry J. H. Chen, K.C. Hsieh · IEEE Electron Device Letters · 2016 · 11 citations

Engineering, Bioengineering, Chemical Engineering +15