V. Bader

Statistics

Publications

Citations

421

H-Index

Active since

2002

Affiliations

Fraunhofer Institute for Reliability and Microintegration(Current)

Technische Universität Berlin

V. Bader is an author at Fraunhofer Institute for Reliability and Microintegration specializing in engineering, packaging engineering, and chip packaging.

Publications per year

2002–2016

Publications

Large area compression molding for Fan-out Panel Level Packing

Tanja Braun, S. Raatz, S. Voges et al. · 2015 · 77 citations

Engineering, Manufacturing Engineering, Manufacturing Processes +11

High-temperature reliability of Flip Chip assemblies

T. Braun, Karl‐Friedrich Becker, Matthias Koch et al. · Microelectronics Reliability · 2005 · 53 citations

Engineering, Materials Engineering, Materials Science +14

Through mold vias for stacking of mold embedded packages

Tanja Braun, K.-F. Becker, S. Voges et al. · 2011 · 40 citations

Engineering, Manufacturing Engineering, Materials Engineering +16

24"×18" Fan-out panel level packing

Tanja Braun, K.-F. Becker, S. Voges et al. · 2014 · 24 citations

Engineering, Manufacturing Engineering, Microfabrication +6

Reliability Potential Of Epoxy Based Encapsulants For Automotive Applications

Tanja Braun, Karl‐Friedrich Becker, Matthias Koch et al. · Microelectronics Reliability · 2005 · 23 citations

Engineering, Materials Engineering, Materials Science +14

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