Concepedia

T. Braun

TB

Statistics

Publications

3

Citations

101

H-Index

3

Active since

2004

Affiliations

Technische Universität Berlin(Current)

Fraunhofer Institute for Reliability and Microintegration

T. Braun is an author at Technische Universität Berlin specializing in chip packaging, engineering, and integrated circuit design.

Publications per year

2004–2005

3

Publications

3

High-temperature reliability of Flip Chip assemblies

T. Braun, Karl‐Friedrich Becker, Matthias Koch et al. · Microelectronics Reliability · 2005 · 53 citations

, , +14

Stackable system-on-packages with integrated components

K.-F. Becker, Erik Jung, Andreas Ostmann et al. · IEEE Transactions on Advanced Packaging · 2004 · 38 citations

, , +17

A New Wafer Level Packaging Approach: Encapsulation, Metallization and Laser Structuring for Advanced System in Package Manufacturing

K.-F. Becker, T. Braun, Alexander Neumann et al. · Journal of Electronic Packaging · 2005 · 10 citations

, , +15

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