Woo-Seop Kim

8 Gb 3-D DDR3 DRAM Using Through-Silicon-Via Technology

Uksong Kang, Hoeju Chung, Seongmoo Heo et al. · IEEE Journal of Solid-State Circuits · 2010 · 487 citations

Engineering, Computer Engineering, Electrical Engineering +15

55 nm capacitor-less 1T DRAM cell transistor with non-overlap structure

Ki‐Whan Song, Hoon Jeong, Jae‐Wook Lee et al. · 2008 · 80 citations

Engineering, Electrical Engineering, Materials Science +17

8Gb 3D DDR3 DRAM using through-silicon-via technology

Uksong Kang, Hoeju Chung, Seongmoo Heo et al. · 2009 · 73 citations

Engineering, Computer Engineering, Electrical Engineering +17

Thermal analysis of the roll in the strip casting process

C.M. Park, Woo-Seop Kim, G.J. Park · Mechanics Research Communications · 2003 · 35 citations

Engineering, Manufacturing Engineering, Materials Engineering +14

A 31 ns Random Cycle VCAT-Based 4F$^{2}$ DRAM With Manufacturability and Enhanced Cell Efficiency

Ki‐Whan Song, Jin‐Young Kim, Jae-Man Yoon et al. · IEEE Journal of Solid-State Circuits · 2010 · 34 citations

Engineering, Computer Engineering, Electrical Engineering +10