Tuan Vo

CVD Co and its application to Cu damascene interconnections

T. Nogami, J. Maniscalco, Anita Madan et al. · 2010 · 43 citations

Materials Science, Materials Engineering, Cvd Co +15

Compact Modeling of LDMOS Transistors for Extreme Environment Analog Circuit Design

Avinash S. Kashyap, H. Alan Mantooth, Tuan Vo et al. · IEEE Transactions on Electron Devices · 2010 · 25 citations

Device Modeling, Low-power Electronics, Electrical Engineering +15

Three-Dimensional Wafer Stacking Using Cu TSV Integrated with 45 nm High Performance SOI-CMOS Embedded DRAM Technology

Pooja Batra, Spyridon Skordas, D. LaTulipe et al. · Journal of Low Power Electronics and Applications · 2014 · 19 citations · Full text

Engineering, Integrated Circuits, Interconnect (Integrated Circuits) +16

Millimeter-wave wireless power transfer technology for space applications

Goutam Chattopadhyay, Harish Manohara, M. Mojarradi et al. · 2008 · 18 citations

Electrical Engineering, Energy Harvesting, Engineering +15

High reliability 32 nm Cu/ULK BEOL based on PVD CuMn seed, and its extendibility

T. Nogami, T. Bolom, A. Simon et al. · 2010 · 17 citations

Engineering, Nm Beol, Interconnect (Integrated Circuits) +16