D. Restaino

High Performance 45-nm SOI Technology with Enhanced Strain, Porous Low-k BEOL, and Immersion Lithography

P. Agnello, T. Ivers, C. Warm et al. · 2006 · 115 citations

Engineering, Vlsi Design, Enhanced Strain +21

Effects of overlayers on electromigration reliability improvement for Cu/low K interconnects

Chunhua Hu, D. Canaperi, S.T. Chen et al. · 2004 · 56 citations

Engineering, Interconnect (Integrated Circuits), Electromigration Reliability Improvement +19

Interface engineering for high interfacial strength between SiCOH and porous SiCOH interconnect dielectrics and diffusion caps

A. Grill, D. Edelstein, Michael A. Lane et al. · Journal of Applied Physics · 2008 · 43 citations

Engineering, High Interfacial Strength, Diffusion Caps +19

Atom motion of Cu and Co in Cu damascene lines with a CoWP cap

C.‐K. Hu, Lynne Gignac, R. Rosenberg et al. · Applied Physics Letters · 2004 · 42 citations

Engineering, Chemistry, Void Growth +16

Electromigration Cu mass flow in Cu interconnections

C.‐K. Hu, D. Canaperi, S.T. Chen et al. · Thin Solid Films · 2005 · 34 citations

Electrical Engineering, Electromigration Technique, Engineering +7