Ji-Won Shin

Bending Properties of Anisotropic Conductive Films Assembled Chip-in-Flex Packages for Wearable Electronics Applications

Jihye Kim, Tae‐Ik Lee, Ji-Won Shin et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2016 · 36 citations

Chip-in-flex Packages, Engineering, Mechanical Engineering +25

The Design of Smart RFID System For Meat Freshness Monitoring

Sen Lin, Kyo-Hwan Hyun, Joo-Woong Kim et al. · Advanced Science and Technology Letters · 2013 · 18 citations

Food Traceability, Meat Packaging, Food Authentication +8

Wafer-Level Packages Using B-Stage Nonconductive Films for Cu Pillar/Sn–Ag Microbump Interconnection

Hyeong-Gi Lee, Yongwon Choi, Ji-Won Shin et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2015 · 15 citations

Engineering, Wafer-level Packages, Interconnect (Integrated Circuits) +19

A novel double layer NCF for highly reliable micro-bump interconnection

Ji-Won Shin, Yongwon Choi, Young Soon Kim et al. · 2014 · 14 citations

Imidazole Ncf, Engineering, Reliable Micro-bump Interconnection +20

A Study on the Double Layer Non Conductive Films (NCFs) for Fine-Pitch Cu-Pillar/Sn-Ag Micro-Bump Interconnection

Seyong Lee, Ji-Won Shin, Hyeong Gi Lee et al. · 2016 · 12 citations

Chip Stacking Packages, 3D-through Silicon Via, Engineering +20