Hyeong Gi Lee

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Active since

2016

Affiliations

Korea Advanced Institute of Science and Technology(Current)

Hyeong Gi Lee is an author at Korea Advanced Institute of Science and Technology specializing in microfabrication, mechanical engineering, and materials engineering.

Top concepts

EngineeringMicrostructureApplied PhysicsMaterial ScienceMicroelectronicsMicrofabricationElectronic PackagingMaterials EngineeringElectrical EngineeringMechanical Engineering

Publications per year

2016–2017

Publications

A Study on the Double Layer Non Conductive Films (NCFs) for Fine-Pitch Cu-Pillar/Sn-Ag Micro-Bump Interconnection

Seyong Lee, Ji-Won Shin, Hyeong Gi Lee et al. · 2016 · 12 citations

Chip Stacking Packages, 3D-through Silicon Via, Engineering +20

Effects of Thermocompression Bonding Parameters on Cu Pillar/Sn-Ag Microbump Solder Joint Morphology Using Nonconductive Films

Hyeong Gi Lee, Ji-Won Shin, Yongwon Choi et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2017 · 10 citations

Friction Welding, Engineering, Mechanical Engineering +21

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