Hyeong-Gi Lee

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Active since

2015

Affiliations

Korea Advanced Institute of Science and Technology(Current)

Hyeong-Gi Lee is an author at Korea Advanced Institute of Science and Technology specializing in applied physics, electronic packaging, and 3d printing.

Top concepts

Thin Films3D PrintingEngineeringApplied PhysicsMaterial ScienceMicroelectronicsMicrofabricationElectronic PackagingElectrical Engineering3D Integration

Publications per year

2015–2015

Publications

Wafer-Level Packages Using B-Stage Nonconductive Films for Cu Pillar/Sn–Ag Microbump Interconnection

Hyeong-Gi Lee, Yongwon Choi, Ji-Won Shin et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2015 · 15 citations

Engineering, Wafer-level Packages, Interconnect (Integrated Circuits) +19

Wafer level packages (WLPs) using B-stage non-conductive films (NCFs) for highly reliable 3D-TSV micro-bump interconnection

Hyeong-Gi Lee, Yongwon Choi, Ji-Won Shin et al. · 2015 · 10 citations

Engineering, Higher Packaging Density, Integrated Circuits +20

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