Ji-Won Shin

Bending Properties of Anisotropic Conductive Films Assembled Chip-in-Flex Packages for Wearable Electronics Applications

Jihye Kim, Tae‐Ik Lee, Ji-Won Shin et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2016 · 37 citations

Natural Sciences, Materials Engineering, Materials Science +11

Characterization and Stability Analysis of Zinc Oxide Nanoencapsulated Conjugated Linoleic Acid

Jin‐Ho Choy, Ji-Won Shin, Seung‐Yong Lim et al. · Journal of Food Science · 2010 · 19 citations

Pharmacy, Chemistry, Food Science +17

Quantitative Profiling of Carotenoids, Tocopherols, Phytosterols, and Fatty Acids in the Flower Petals of Ten Marigold (Tagetes spp. L.) Cultivars

Ramesh Kumar Saini, Hui-Yeon Ahn, Geon-Woo Park et al. · Foods · 2023 · 19 citations · Full text

Life Sciences, Botany, Plant Biology +14

The Design of Smart RFID System For Meat Freshness Monitoring

Sen Lin, Kyo-Hwan Hyun, Joo-Woong Kim et al. · Advanced Science and Technology Letters · 2013 · 18 citations

Agriculture, Food Science, Food Engineering +13

Wafer-Level Packages Using B-Stage Nonconductive Films for Cu Pillar/Sn–Ag Microbump Interconnection

Hyeong-Gi Lee, Yongwon Choi, Ji-Won Shin et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2015 · 15 citations

Engineering, Electrical Engineering, Materials Engineering +17