H.B. Pogge

Electrical integrity of state-of-the-art 0.13 μm SOI CMOS devices and circuits transferred for three-dimensional (3D) integrated circuit (IC) fabrication

K.W. Guarini, Anna W. Topol, M. Ieong et al. · 2003 · 134 citations

Engineering, Computer Engineering, Electrical Engineering +17

Wafer-Scale Microdevice Transfer/Interconnect: Its Application in an AFM-Based Data-Storage System

M. Despont, Ute Drechsler, R. Yu et al. · Journal of Microelectromechanical Systems · 2004 · 88 citations

Engineering, Computer Engineering, Electrical Engineering +15

The heteroepitaxial growth of GaP films on Si substrates

H.B. Pogge, B.M. Kemlage, R.W. Broadie · Journal of Crystal Growth · 1977 · 27 citations

Natural Sciences, Materials Engineering, Materials Science +16

Wafer-scale microdevice transfer/interconnect: from a new integration method to its application in an afm-based data-storage system

M. Despont, Ute Drechsler, R. Yu et al. · 2004 · 26 citations

Engineering, Computer Engineering, Electrical Engineering +14

Reactive Ion Etching of Silicon with Cl2 / Ar ( 1 )

H.B. Pogge, James A. Bondur, P. J. Burkhardt · Journal of The Electrochemical Society · 1983 · 20 citations

Engineering, Materials Engineering, Materials Science +17