Gilroy Vandentop

Electrical performance of bumpless build-up layer packaging

Henning Braunisch, Steven N. Towle, R.D. Emery et al. · 2003 · 53 citations

Engineering, Electrical Engineering, Heat Transfer +13

Bumpless Build-Up Layer Packaging

Steven N. Towle, Henning Braunisch, Chuan Hu et al. · 2001 · 41 citations

Engineering, Electrical Engineering, Materials Science +17

EUV mask pattern defect printability

Ted Liang, Guojing Zhang, Patrick Naulleau et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 2006 · 23 citations

Natural Sciences, Electrical Engineering, Materials Science +17

Sea of leads compliant I/O interconnect process integration for the ultimate enabling of chips with low-k interlayer dielectrics

Muhannad S. Bakir, B. Dang, R.D. Emery et al. · IEEE Transactions on Advanced Packaging · 2005 · 18 citations

Engineering, Computer Engineering, Electrical Engineering +17

Optical I/O technology for digital VLSI

Thomas P. Thomas, Daoqiang Lu, Henning Braunisch et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 2004 · 15 citations

Engineering, Computer Engineering, Electrical Engineering +17