2001 · 41 citations · 3 references
EngineeringElectrical EngineeringMaterials ScienceMicroelectromechanical SystemsMicroelectronicsPackaging DesignChip PackagingIntegrated Circuit DesignIntegrated Circuit FabricationMems PackagingPackaging EngineeringPackaging MaterialsAdvanced PackagingDevice PackagingDielectric ConstantPackaging RequirementsPackaging TechniquesScalabilityStress Management In PackagingThermo-mechanical Stress
Abstract Bumpless Build-Up Layer (BBUL) is a novel package developed to meet future packaging technology requirements. The BBUL package provides the advantages of small electrical loop inductance and reduced thermomechanical stresses on low dielectric constant (low-k) die materials. Furthermore, it allows for high lead count, ready integration of multiple electronic and optical components [such as logic, memory, radio frequency, microelectromechanical systems (MEMS), among others], and inherent scalability. In the present paper we investigate and discuss some of the process, routing, electrical, thermal, and mechanical attributes of BBUL.
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