Statistics
Publications
2
Citations
94
H-Index
2
Active since
2001
Affiliations
Intel (United Kingdom)(Current)
Chuan Hu is an author at Intel (United Kingdom) specializing in dielectric constant, mems packaging, and device packaging.
Publications per year
2001–2003
2
2
Electrical performance of bumpless build-up layer packaging
Henning Braunisch, Steven N. Towle, R.D. Emery et al. · 2003 · 53 citations
Bumpless Build-Up Layer Packaging
Steven N. Towle, Henning Braunisch, Chuan Hu et al. · 2001 · 41 citations
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