Oliver Ansell

Characterization of Extreme Si Thinning Process for Wafer-to-Wafer Stacking

Fumihiro Inoue, Anne Jourdain, Joeri De Vos et al. · 2016 · 24 citations

Materials Science, Wafer Scale Processing, Engineering +14

A new plasma source for next generation MEMS deep Si etching: Minimal tilt, improved profile uniformity and higher etch rates

Richard Barnett, Dave Thomas, Yiping Song et al. · 2010 · 20 citations

Engineering, Integrated Circuits, Profile Uniformity +21

Extreme wafer thinning optimization for via-last applications

Anne Jourdain, Joeri De Vos, Fumihiro Inoue et al. · 2016 · 17 citations

Engineering, Extreme Wafer, Interconnect (Integrated Circuits) +17

Considerations and benefits of plasma etch based wafer dicing

Richard Barnett, Oliver Ansell, Dave Thomas · 2013 · 11 citations

3D Ic Architecture, Electrical Engineering, Wafer Scale Processing +13