Concepedia
Statistics
Publications
16
Citations
312
H-Index
11
Active since
1978
Affiliations
Philips (Netherlands)(Current)
NXP (Netherlands)
University of Twente
Eindhoven University of Technology
University of Groningen
J. Bisschop is an author at Philips (Netherlands) specializing in engineering, microelectronics, and electrical engineering.
Top concepts
EngineeringMicroelectronicsElectrical EngineeringApplied PhysicsElectronic PackagingElectrical InsulationMaterial SciencePhysicsHeat TransferThermal Engineering
Publications per year
1978–2016
The physics of SiO<sub>2</sub>layers
J.F. Verwey, E. A. Amerasekera, J. Bisschop · Reports on Progress in Physics · 1990 · 62 citations
Engineering, Silicon On Insulator, Nanoelectronics +17
The Relation Between Degradation Under DC and RF Stress Conditions
A.J. Scholten, Daniel Stephens, G.D.J. Smit et al. · IEEE Transactions on Electron Devices · 2011 · 36 citations
Rf Stress Conditions, Electrical Engineering, Reliability Engineering +15
Effect of thermal gradients on the electromigration life-time in power electronics
Cora Salm, B.H. Krabbenborg, Kirsten Weide-Zaage et al. · 2004 · 32 citations · Full text
Engineering, Electromigration-induced Failures, Shorter Electromigration Lifetimes +19
Vertical die crack stresses of Flip Chip induced in major package assembly processes
Daoguo Yang, L.J. Ernst, C. van ‘t Hof et al. · Microelectronics Reliability · 2000 · 26 citations
Materials Science, Flip Chip, Chip-scale Package +11
Fast temperature cycling and electromigration induced thin film cracking in multilevel interconnection: experiments and modeling
Cora Salm, J. Vroemen, J. P. Voets et al. · Microelectronics Reliability · 2002 · 22 citations
Electrical Engineering, Fast Temperature Cycling, Engineering +9
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