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Fast temperature cycling and electromigration induced thin film cracking in multilevel interconnection: experiments and modeling
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2002
Year
Electrical EngineeringFast Temperature CyclingEngineeringAdvanced Packaging (Semiconductors)Electromigration TechniqueApplied PhysicsTime-dependent Dielectric BreakdownMultilevel InterconnectionElectronic PackagingMicroelectronicsDynamic Crack PropagationElectrical Insulation
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