2004 · 32 citations · 4 references
EngineeringElectromigration-induced FailuresShorter Electromigration LifetimesPower ElectronicsThermodynamicsTemperature GradientElectronic PackagingThermal GradientsElectrical EngineeringElectromigration TechniqueHardware ReliabilityTime-dependent Dielectric BreakdownHeat TransferDevice ReliabilityMicroelectronicsPhysic Of FailureElectrochemistryElectromigration Life-timeApplied PhysicsCircuit ReliabilityThermal EngineeringElectrical Insulation
The combined effects of electromigration and thermomigration are studied. Significantly shorter electromigration lifetimes are observed in the presence of a temperature gradient. This cannot be explained by thermomigration only, but is attributed to the effect of temperature gradient on electromigration-induced failures.
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