Kirsten Weide-Zaage

Static and dynamic analysis of failure locations and void formation in interconnects due to various migration mechanisms

Kirsten Weide-Zaage, David Dalleau, Xiaoying Yu · Materials Science in Semiconductor Processing · 2003 · 42 citations

Electrical Engineering, Reliability Engineering, Engineering +11

Effect of thermal gradients on the electromigration life-time in power electronics

Cora Salm, B.H. Krabbenborg, Kirsten Weide-Zaage et al. · 2004 · 32 citations · Full text

Engineering, Electromigration-induced Failures, Shorter Electromigration Lifetimes +19

Simulation of time depending void formation in copper, aluminum and tungsten plugged via structures

David Dalleau, Kirsten Weide-Zaage, Y. Danto · Microelectronics Reliability · 2003 · 30 citations

Engineering, Void Formation, Mechanical Engineering +4

Determination of migration effects in Cu-via structures with respect to process-induced stress

Kirsten Weide-Zaage, Jiani Zhao, Joharsyah Ciptokusumo et al. · Microelectronics Reliability · 2008 · 23 citations

Materials Science, Materials Engineering, Cu-via Structures +15

Exemplified calculation of stress migration in a 90nm node via structure

Kirsten Weide-Zaage · 2010 · 21 citations

Engineering, Mechanical Engineering, Residual Stress +20