Determination of migration effects in Cu-via structures with respect to process-induced stress

Development of a Low-Dielectric-Constant Polymer for the Fabrication of Integrated Circuit Interconnect

Steven J. Martin, J. P. Godschalx, M. E. Mills et al. · Advanced Materials · 2000 · 337 citations · Full text

Natural Sciences, Materials Engineering, Materials Science +14

Static and dynamic analysis of failure locations and void formation in interconnects due to various migration mechanisms

Kirsten Weide-Zaage, David Dalleau, Xiaoying Yu · Materials Science in Semiconductor Processing · 2003 · 42 citations

Engineering, Materials Engineering, Materials Science +17

Simulation of time depending void formation in copper, aluminum and tungsten plugged via structures

David Dalleau, Kirsten Weide-Zaage, Y. Danto · Microelectronics Reliability · 2003 · 30 citations

Natural Sciences, Materials Engineering, Materials Science +12

Effect of packaging on interfacial cracking in Cu/ low k Damascene structures

Guotao Wang, S. Groothuis, Paul S. Ho · 2004 · 21 citations

Engineering, Materials Engineering, Materials Science +17