Oliver Aubel

Electromigration early failure void nucleation and growth phenomena in Cu and Cu(Mn) interconnects

Meike Hauschildt, C. Hennesthal, G. Talut et al. · 2013 · 50 citations

Engineering, Early Failure Population, Growth Phenomena +16

Grain structure analysis and effect on electromigration reliability in nanoscale Cu interconnects

Linjun Cao, K. J. Ganesh, Lijuan Zhang et al. · Applied Physics Letters · 2013 · 44 citations

Engineering, Interconnect (Integrated Circuits), Wafer Scale Processing +21

Stress-induced phenomena in nanosized copper interconnect structures studied by x-ray and electron microscopy

Ehrenfried Zschech, R. Huebner, Dmytro Chumakov et al. · Journal of Applied Physics · 2009 · 41 citations · Full text

Engineering, Severe Plastic Deformation, Defect Tolerance +19

Effects of cap layer and grain structure on electromigration reliability of Cu/low-k interconnects for 45 nm technology node

L. Zhang, Jixuan Zhou, Jay Im et al. · 2010 · 25 citations

Engineering, Interconnect (Integrated Circuits), Wafer Scale Processing +19

Determination of migration effects in Cu-via structures with respect to process-induced stress

Kirsten Weide-Zaage, Jiani Zhao, Joharsyah Ciptokusumo et al. · Microelectronics Reliability · 2008 · 23 citations

Materials Science, Materials Engineering, Cu-via Structures +15