Chuichi Miyazaki

Wafer thinning, bonding, and interconnects induced local strain/stress in 3D-LSIs with fine-pitch high-density microbumps and through-Si vias

M. Murugesan, Hisashi Kino, Hiroshi Nohira et al. · 2010 · 81 citations

Engineering, Materials Engineering, Materials Science +17

High density 3D LSI technology using W/Cu hybrid TSVs

M. Murugesan, Hisashi Kino, A. Hashiguchi et al. · 2011 · 44 citations

Engineering, Electrical Engineering, Materials Science +17

Ultra-Thin 3D-Stacked SIP Formed using Room-Temperature Bonding between Stacked Chips

N. Tanaka, Y. Yoshimira, T. Naito et al. · 2005 · 22 citations

Engineering, Computer Engineering, Materials Science +17

Development of wafer thinning and dicing technology for thin wafer

Chuichi Miyazaki, H. Shimamoto, Toshihide Uematsu et al. · 2009 · 19 citations

Engineering, Manufacturing Engineering, Materials Science +14

Low-Cost Through-hole Electrode Interconnection for 3D-SiP Using Room-temperature Bonding

N. Tanaka, Yasuhiro Yoshimura, T. Naito et al. · 2006 · 15 citations

Engineering, Electrical Engineering, Manufacturing Engineering +17