Koichi Yatsuda

Pattern scaling with directed self assembly through lithography and etch process integration

Benjamen M. Rathsack, Mark Somervell, Josh Hooge et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 2012 · 53 citations

Engineering, Materials Engineering, Materials Science +16

Cryo atomic layer etching of SiO2 by C4F8 physisorption followed by Ar plasma

Gaëlle Antoun, Philippe Lefaucheux, Thomas Tillocher et al. · Applied Physics Letters · 2019 · 37 citations

Natural Sciences, Materials Engineering, Materials Science +14

Cryogenic etching processes applied to porous low-<i>k</i>materials using SF₆/C₄F₈plasmas

Frédéric Leroy, L. Zhang, Thomas Tillocher et al. · Journal of Physics D Applied Physics · 2015 · 27 citations

Natural Sciences, Materials Engineering, Materials Science +11

Advances in directed self assembly integration and manufacturability at 300 mm

Benjamen M. Rathsack, Mark Somervell, Makato Muramatsu et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 2013 · 26 citations

Engineering, Manufacturing Engineering, Materials Engineering +15

The role of physisorption in the cryogenic etching process of silicon

Gaëlle Antoun, Rémi Dussart, Thomas Tillocher et al. · Japanese Journal of Applied Physics · 2019 · 25 citations

Natural Sciences, Materials Engineering, Materials Science +17