Benjamen M. Rathsack

Pattern scaling with directed self assembly through lithography and etch process integration

Benjamen M. Rathsack, Mark Somervell, Josh Hooge et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 2012 · 53 citations

Engineering, Electron-beam Lithography, Pattern Transfer +24

Advances in directed self assembly integration and manufacturability at 300 mm

Benjamen M. Rathsack, Mark Somervell, Makato Muramatsu et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 2013 · 26 citations

Fabrication of 28nm pitch Si fins with DSA lithography

Gerard M. Schmid, Richard A. Farrell, Ji Xu et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 2013 · 25 citations

Patterning Step, Pattern Formation, Wafer Scale Processing +15

High-volume manufacturing equipment and processing for directed self-assembly applications

Mark Somervell, Takashi Yamauchi, Soichiro Okada et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 2014 · 22 citations

Engineering, Electron-beam Lithography, Pattern Transfer +18

An enhanced 90nm high performance technology with strong performance improvements from stress and mobility increase through simple process changes

R. Khamankar, H. Bu, C. Bowen et al. · 2004 · 21 citations

Engineering, Vlsi Design, Class Performance +19