Ricardo Cotrin Teixeira

3D stacked IC demonstration using a through Silicon Via First approach

J. Van Olmen, A. Mercha, Guruprasad Katti et al. · 2008 · 141 citations

Engineering, Silicon Vias, Oscillator Topologies +18

Micro-Raman stress characterization of polycrystalline silicon films grown at high temperature

Ricardo Cotrin Teixeira, I. Dói, M.B.P. Zakia et al. · Materials Science and Engineering B · 2004 · 52 citations

Materials Science, Engineering, High Temperature +8

Process induced sub-surface damage in mechanically ground silicon wafers

Yang Yu, Koen De Munck, Ricardo Cotrin Teixeira et al. · Semiconductor Science and Technology · 2008 · 36 citations

Engineering, Mechanical Engineering, Silicon On Insulator +18

3D Embedding and Interconnection of Ultra Thin (≪ 20 μm) Silicon Dies

F. Iker, Deniz Sabuncuoglu Tezcan, Ricardo Cotrin Teixeira et al. · 2007 · 19 citations

Engineering, Integrated Circuits, Thin Film Process Technology +26

Stress Analysis on Ultra Thin Ground Wafers

Ricardo Cotrin Teixeira, Koen De Munck, Piet De Moor et al. · Journal of Integrated Circuits and Systems · 2020 · 13 citations · Full text

Engineering, Thinning Process, Mechanical Engineering +20