Koen De Munck

3D integration by Cu-Cu thermo-compression bonding of extremely thinned bulk-Si die containing 10 μm pitch through-Si vias

Bart Swinnen, Wouter Ruythooren, Piet De Moor et al. · 2006 · 190 citations

Engineering, Mechanical Engineering, Extreme Wafer Thinning +19

The RELAXd project: Development of four-side tilable photon-counting imagers

Z. Vykydal, J. Visschers, Deniz Sabuncuoglu Tezcan et al. · Nuclear Instruments and Methods in Physics Research Section A Accelerators Spectrometers Detectors and Associated Equipment · 2008 · 41 citations

Photonics, Quantum Science, Engineering +6

Process induced sub-surface damage in mechanically ground silicon wafers

Yang Yu, Koen De Munck, Ricardo Cotrin Teixeira et al. · Semiconductor Science and Technology · 2008 · 36 citations

Engineering, Mechanical Engineering, Silicon On Insulator +18

Development of vertical and tapered via etch for 3D through wafer interconnect technology

Deniz Sabuncuoglu Tezcan, Koen De Munck, Nga Pham et al. · 2006 · 35 citations

Wafer Interconnect Technology, Electrical Engineering, Wafer Scale Processing +15

Enhanced time delay integration imaging using embedded CCD in CMOS technology

Piet De Moor, Jo Robbelein, L. Haspeslagh et al. · 2014 · 29 citations

New Imager Platform, Electrical Engineering, Embedded Ccd +14