Enhanced time delay integration imaging using embedded CCD in CMOS technology

Abstract

This paper presents a new imager platform developed at imec enabling the monolithic integration of 130 nm CMOS image sensors (CMOS/CIS) with charge coupled devices (CCD). The process module was successfully developed and the potential of this embedded CCD in CMOS (eCCD) was demonstrated with the fabrication of a time delay integration (TDI) imager.