David Tarng

A Comparative Study of 2.5D and Fan-out Chip on Substrate : Chip First and Chip Last

Wei‐Hong Lai, Penny Yang, Ian Hu et al. · 2020 · 42 citations

Engineering, Computer Engineering, Electrical Engineering +17

Inhibiting the detrimental Cu protrusion in Cu through-silicon-via by highly (111)-oriented nanotwinned Cu

Ting-Chun Lin, Chien-Lung Liang, Shan-Bo Wang et al. · Scripta Materialia · 2021 · 39 citations

Engineering, Materials Engineering, Materials Science +10

Electromigration Reliability of Advanced High-Density Fan-Out Packaging With Fine-Pitch 2-/2-<i>μ</i>m L/S Cu Redistribution Lines

Chien-Lung Liang, Yung‐Sheng Lin, Chin‐Li Kao et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2020 · 36 citations

Engineering, Electrical Engineering, Materials Science +17

FE Simulation Model for Warpage Evaluation of Glass Interposer Substrate Packages

Meng-Kai Shih, Karen Chen, Teck Lee et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2021 · 36 citations

Engineering, Electrical Engineering, Materials Engineering +17

Fan-Out Chip on Substrate Device Interconnection Reliability Analysis

Ying-Chih Lee, Wei‐Hong Lai, Ian Hu et al. · 2017 · 35 citations

Engineering, Electrical Engineering, Packaging Design +16