Concepedia

Author

Brian Sapp

University at Albany, State University of New York

Also Known As

B. Sapp, Brian C. Sapp, Brian Sapp

22

Publications

138

Citations

6

H-Index

12

Concepts

All Affiliations

University at Albany, State University of New York
BS

About

Brian Sapp is an author at University at Albany, State University of New York specializing in 3d printing, electronic packaging, and microelectronics.

Top Concepts

#ConceptH-IndexPublicationsCitations

1

Engineering

2

2

45

2

Applied Physics

1

1

30

3

Materials Science

1

1

30

4

Mechanical Engineering

1

1

15

5

Advanced Packaging

1

1

15

Brian Sapp

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4

Publications

97

Citations

4

H-Index

YearCitations

Manufacturable plastic microfluidic valves using thermal actuation

Karthik Pitchaimani, Brian Sapp, Adam Winter,

Lab on a Chip

2009

40

Metrology needs for through-silicon via fabrication

Victor Vartanian, Richard A. Allen, Larry Smith,

Journal of Micro/Nanolithography MEMS and MOEMS

2014

30

Challenges in thin wafer handling and processing

Stephen Olson, Klaus Hummler, Brian Sapp

2013

15

TSV and Cu-Cu direct bond wafer and package-level reliability

Klaus Hummler, Brian Sapp, J. R. Lloyd,

2013

12

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