Andreas Martin

Hybrid bonding for 3D stacked image sensors: impact of pitch shrinkage on interconnect robustness

J. Jourdon, S. Lhostis, S. Moreau et al. · 2018 · 81 citations

Engineering, Device Integration, Integrated Circuits +24

Review on the reliability characterization of plasma-induced damage

Andreas Martin · Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena · 2009 · 71 citations

Reliability, Electrical Engineering, Reliability Engineering +13

Fast Wafer Level Reliability Monitoring: Quantification of Plasma-Induced Damage Detected on Productive Hardware

Andreas Martin, Christoph Bukethal, Karl-Henrik Ryden · IEEE Transactions on Device and Materials Reliability · 2009 · 32 citations

Engineering, Measurement, Productive Hardware +19

An introduction to fast wafer level reliability monitoring for integrated circuit mass production

Andreas Martin, R.‐P. Vollertsen · Microelectronics Reliability · 2004 · 25 citations

Reliability, Electrical Engineering, Reliability Engineering +14

A Study of NBTI and Short-Term Threshold Hysteresis of Thin Nitrided and Thick Non-Nitrided Oxides

H. Reisinger, R.‐P. Vollertsen, P.-J. Wagner et al. · IEEE Transactions on Device and Materials Reliability · 2009 · 19 citations

Engineering, Thin Nitrided, Defect Tolerance +19