E. Demm

A 0.13 μm CMOS platform with Cu/low-k interconnects for system on chip applications

T. Schiml, S. Biesemans, G. Brase et al. · 2002 · 53 citations

Engineering, Computer Engineering, Electrical Engineering +17

A comparison of focused ion beam and electron beam induced deposition processes

S. Lipp, L. Frey, C. Lehrer et al. · Microelectronics Reliability · 1996 · 50 citations

Natural Sciences, Materials Engineering, Materials Science +10

Investigations on the topology of structures milled and etched by focused ion beams

S. Lipp, L. Frey, C. Lehrer et al. · Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena · 1996 · 49 citations

Engineering, Materials Engineering, Materials Science +16

Tetramethoxysilane as a precursor for focused ion beam and electron beam assisted insulator (SiO<i>x</i>) deposition

S. Lipp, L. Frey, C. Lehrer et al. · Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena · 1996 · 45 citations

Natural Sciences, Materials Engineering, Materials Science +14

Local material removal by focused ion beam milling and etching

S. Lipp, L. Frey, Gerhard Franz et al. · Nuclear Instruments and Methods in Physics Research Section B Beam Interactions with Materials and Atoms · 1995 · 15 citations

Engineering, Materials Engineering, Materials Science +14