M. Offenberg

Bosch deep silicon etching: improving uniformity and etch rate for advanced MEMS applications

F. Laerme, A. Schilp, K. Funk et al. · 1999 · 170 citations

Engineering, Radio Frequency, Improving Uniformity +19

Kinetics of silicon epitaxy using SiH4 in a rapid thermal chemical vapor deposition reactor

M. Liehr, C. Michael Greenlief, S. R. Kasi et al. · Applied Physics Letters · 1990 · 131 citations

Engineering, Surface Hydrogen, Chemistry +16

Novel Process For A Monolithic Integrated Accelerometer

M. Offenberg, Franz Lärmer, B. Elsner et al. · Proceedings of the International Solid-State Sensors and Actuators Conference - TRANSDUCERS '95 · 2005 · 121 citations

Engineering, Accelerometer, Sensor Structure +16

Paramagnetic Point Defects in Amorphous Silicon Dioxide and Amorphous Silicon Nitride Thin Films: I .

W. L. Warren, Edward H. Poindexter, M. Offenberg et al. · Journal of The Electrochemical Society · 1992 · 98 citations

Thin Film Physics, Engineering, Thin Film Process Technology +16

Equilibrium surface hydrogen coverage during silicon epitaxy using SiH4

M. Liehr, C. Michael Greenlief, M. Offenberg et al. · Journal of Vacuum Science & Technology A Vacuum Surfaces and Films · 1990 · 97 citations

Engineering, Physics, Hydrogen Transition +13