Concepedia
Statistics
Publications
4
Citations
243
H-Index
Active since
2010
Affiliations
Institut polytechnique de Grenoble(Current)
Laboratoire d'Électronique des Technologies de l'Information
Commissariat à l'Énergie Atomique et aux Énergies Alternatives
CEA Grenoble
STMicroelectronics (France)
C. Euvrard is an author at Institut polytechnique de Grenoble specializing in wafer bonding, engineering, and electrical engineering.
Publications per year
2010–2018
Vertically stacked-NanoWires MOSFETs in a replacement metal gate process with inner spacer and SiGe source/drain
Sylvain Barraud, V. Lapras, Marie-Pierre Samson et al. · 2016 · 110 citations · Full text
Engineering, Electrical Engineering, Materials Science +17
Hybrid bonding for 3D stacked image sensors: impact of pitch shrinkage on interconnect robustness
J. Jourdon, S. Lhostis, S. Moreau et al. · 2018 · 84 citations
Engineering, Electrical Engineering, Microelectromechanical Systems +16
Recent developments of Cu-Cu non-thermo compression bonding for wafer-to-wafer 3D stacking
Ionut Radu, Didier Landru, G. Gaudin et al. · 2010 · 29 citations
Natural Sciences, Materials Engineering, Materials Science +13
Fine pitch 3D interconnections with hybrid bonding technology: From process robustness to reliability
L. Arnaud, S. Moreau, A. Jouve et al. · 2018 · 20 citations
Engineering, Electrical Engineering, Computer-integrated Manufacturing +16
1–4 of 4