G. Gaudin

An Overview of Patterned Metal/Dielectric Surface Bonding: Mechanism, Alignment and Characterization

L. Di Cioccio, Pierric Gueguen, R. Taïbi et al. · Journal of The Electrochemical Society · 2011 · 85 citations

Natural Sciences, Materials Engineering, Materials Science +17

Recent developments of Cu-Cu non-thermo compression bonding for wafer-to-wafer 3D stacking

Ionut Radu, Didier Landru, G. Gaudin et al. · 2010 · 29 citations

Natural Sciences, Materials Engineering, Materials Science +13

300 mm InGaAs-on-insulator substrates fabricated using direct wafer bonding and the Smart Cut™ technology

J. Widiez, S. Sollier, T. Baron et al. · Japanese Journal of Applied Physics · 2016 · 25 citations

Engineering, Materials Engineering, Materials Science +17

3D sequential stacked planar devices on 300 mm wafers featuring replacement metal gate junction-less top devices processed at 525°C with improved reliability

A. Vandooren, J. Franco, Bertrand Parvais et al. · 2018 · 25 citations

Engineering, Electrical Engineering, Microelectronics +16

150 mm SiC Engineered Substrates for High-Voltage Power Devices

Séverin Rouchier, G. Gaudin, J. Widiez et al. · Materials science forum · 2022 · 25 citations · Full text

Engineering, Electrical Engineering, Materials Science +17