J. Widiez

3DVLSI with CoolCube process: An alternative path to scaling

P. Batude, C. Fenouillet-Béranger, L. Pasini et al. · 2015 · 134 citations

Engineering, Vlsi Design, Computer Architecture +23

Multiple gate devices: advantages and challenges

T. Poiroux, M. Vinet, O. Faynot et al. · Microelectronic Engineering · 2005 · 130 citations

Electrical Engineering, Engineering, Device Integration +4

Bonded planar double-metal-gate NMOS transistors down to 10 nm

M. Vinet, T. Poiroux, J. Widiez et al. · IEEE Electron Device Letters · 2005 · 128 citations

Alignment Marks, Electrical Engineering, Engineering +7

Lasing in strained germanium microbridges

F. T. Armand Pilon, Alexey Lyasota, Yann‐Michel Niquet et al. · Nature Communications · 2019 · 128 citations · Full text

1.9% bi-axial tensile strain in thick germanium suspended membranes fabricated in optical germanium-on-insulator substrates for laser applications

Alban Gassenq, K. Guilloy, Guilherme Osvaldo Dias et al. · Applied Physics Letters · 2015 · 83 citations

Optical Materials, Engineering, Laser Applications +18