Concepedia
Statistics
Publications
3
Citations
86
H-Index
Active since
2009
Affiliations
Institute of Microelectronics(Current)
Medtronic (United States)
Agency for Science, Technology and Research
Andy Fenner is an author at Institute of Microelectronics specializing in engineering, chip packaging, and biomedical engineering.
Publications per year
2009–2010
Development of 3-D silicon die stacked package using flip chip technology with micro bump interconnects
Srinivasa Rao Vempati, Nandar Su, Chee Houe Khong et al. · 2009 · 42 citations
Engineering, Biomedical Engineering, Microelectromechanical Systems +14
Process Development and Reliability of Microbumps
Sharon Pei-Siang Lim, Vempati Srinivasa Rao, Wai Yin Hnin et al. · IEEE Transactions on Components and Packaging Technologies · 2010 · 28 citations
Engineering, Materials Engineering, Materials Science +14
Numerical modeling of through silicon via (TSV) stacked module with micro bump interconnect for biomedical device
Chee Houe Khong, Xiaowu Zhang, Navas Khan et al. · 2010 · 16 citations
Engineering, Biomedical Engineering, Electrical Engineering +17
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