Effects of nitrogen in HfSiON gate dielectric on the electrical and thermal characteristics

M. Koyama, A. Kaneko, Tsunehiro Ino, +10

EngineeringThermal CharacteristicsSilicon On InsulatorSemiconductor DeviceNanoelectronics +16

High-performance poly-Ge short-channel metal–oxide–semiconductor field-effect transistors formed on SiO₂layer by flash lamp annealing

Koji Usuda, Yoshiki Kamata, Yuuichi Kamimuta, +3

Applied Physics Express

Materials ScienceSemiconductor TechnologyElectrical EngineeringElectronic DevicesEngineering +12

Operation of inverter and ring oscillator of ultrathin-body poly-Ge CMOS

Yoshiki Kamata, M. Koike, Etsuo Kurosawa, +5

Applied Physics Express

Electrical EngineeringEngineeringGe Cmos InverterNanoelectronicsBias Temperature Instability +9

Determination of Band Alignment of Hafnium Silicon Oxynitride/Silicon (HfSiON/Si) Structures using Electron Spectroscopy

Yuuichi Kamimuta, M. Koike, Tsunehiro Ino, +4

Japanese Journal of Applied Physics

EngineeringSilicon On InsulatorBandgap EnergySemiconductorsElectron Spectroscopy +14

High-performance tri-gate poly-Ge junction-less p- and n-MOSFETs fabricated by flash lamp annealing process

Koji Usuda, Y. Kamata, Y. Kamimuta, +3

Materials ScienceSemiconductor TechnologyElectrical EngineeringEngineeringInsulator Layers +13

Scanning tunneling microscope study of the c(2×8) ordering in the ``1×1'' phase on the quenched Si(111) surface

M. Koike, Yasuaki Einaga, Hiroyuki Hirayama, +1

Physical review. B, Condensed matter

EngineeringFault LayerTunneling MicroscopyAtomic StructureDimer Chain Model +15

Study of peeling properties of pressure-sensitive adhesives using a newly developed image processing system

Zenichi Miyagi, M. Koike, Yoshiaki URAHAMA, +1

International Journal of Adhesion and Adhesives

Materials ScienceEngineeringImage Processing SystemMicrofabricationAdhesive Material +3

Direct determination of crosslinking and chain scission in polymers

D. I. C. Kells, M. Koike, J. E. Guillet

Journal of Polymer Science Part A-1 Polymer Chemistry

EngineeringGel Dose GChemistryPolymersChain Scission +14

Effect of Hf-N bond on properties of thermally stable amorphous HfSiON and applicability of this material to sub-50nm technology node LSIs

M. Koike, Tsunehiro Ino, Y. Kamimuta, +6

High Thermal StabilityEngineeringChemistrySilicon On InsulatorBoron Nitride +14

Modulation of NiGe/Ge Contact Resistance by S and P Co-introduction

M. Koike, Yuuichi Kamimuta, Tsutomu Tezuka

Applied Physics Express

Materials EngineeringSemiconductor TechnologyElectrical EngineeringElectronic DevicesEngineering +9