R. Segaud

Active Interposer Technology for Chiplet-Based Advanced 3D System Architectures

P. Coudrain, P. Chausse, L. Arnaud et al. · 2019 · 65 citations

Engineering, Computer Engineering, Computer Systems +17

16kbit 1T1R OxRAM arrays embedded in 28nm FDSOI technology demonstrating low BER, high endurance, and compatibility with core logic transistors

L. Grenouillet, N. Castellani, A. Persico et al. · 2021 · 31 citations

Engineering, Computer Engineering, Electrical Engineering +12

Towards efficient and reliable 300mm 3D technology for wide I/O interconnects

P. Coudrain, Jean-Philippe Colonna, C. Aumont et al. · 2012 · 19 citations

Engineering, Computer Engineering, Electrical Engineering +17

Electrical and morphological assessment of via middle and backside process technology for 3D integration

Jean-Philippe Colonna, P. Coudrain, G. Garnier et al. · 2012 · 14 citations

Engineering, Electrical Engineering, Manufacturing Processes +16