N. Bouzaida

Low-loss submicrometer silicon-on-insulator rib waveguides and corner mirrors

S. Lardenois, Laurent Vivien, Éric Cassan et al. · Optics Letters · 2003 · 126 citations

Advances in 3D CMOS sequential integration

P. Batude, M. Vinet, A. Pouydebasque et al. · 2009 · 114 citations

Engineering, Vlsi Design, Sequential Cmos Integration +17

Wafer level packaging technology development for CMOS image sensors using Through Silicon Vias

Jean Charbonnier, David Henry, F. Jacquet et al. · 2008 · 21 citations

Backside Technology, Engineering, Device Integration +17

3D Integration of CMOS image sensor with coprocessor using TSV last and micro-bumps technologies

P. Coudrain, D. Henry, A. Berthelot et al. · 2013 · 18 citations

Engineering, Face-to-back Integration Scheme, Integrated Circuits +17

High density 3D silicon interposer technology development and electrical characterization for high end applications

Jean Charbonnier, M. Assous, Jean-Philippe Bally et al. · 2012 4th Electronic System-Integration Technology Conference · 2012 · 14 citations

Engineering, Integrated Circuits, High End Applications +24