Jean-Philippe Bally

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Active since

2012

Affiliations

Shinko Electric Industries (Japan)(Current)

CEA Grenoble

Jean-Philippe Bally is an author at Shinko Electric Industries (Japan) specializing in advanced packaging, 3d integration, and integrated circuit design.

Top concepts

3D PrintingEngineering3D IntegrationApplied PhysicsNanoelectronicsMicroelectronicsMicrofabricationAdvanced PackagingIntegrated CircuitsComputer Engineering

Publications per year

2012–2013

Publications

Warpage control of silicon interposer for 2.5D package application

Kei Murayama, Mitsuhiro Aizawa, K. Hara et al. · 2013 · 42 citations

High density 3D silicon interposer technology development and electrical characterization for high end applications

Jean Charbonnier, M. Assous, Jean-Philippe Bally et al. · 2012 4th Electronic System-Integration Technology Conference · 2012 · 14 citations

Engineering, Integrated Circuits, High End Applications +24

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