Lancy Tsung

Stress-induced voiding under vias connected to wide Cu metal leads

E.T. Ogawa, J. W. McPherson, J. Rosal et al. · 2003 · 149 citations

Engineering, Severe Plastic Deformation, Mechanical Engineering +17

Chemical vapour deposition of the oxides of titanium, zirconium and hafnium for use as high-k materials in microelectronic devices. A carbon-free precursor for the synthesis of hafnium dioxide

Ryan C. Smith, Tiezhong Ma, Noel Hoilien et al. · Advanced Materials for Optics and Electronics · 2000 · 143 citations

Engineering, Vacuum Device, Chemistry +16

Heterogeneous abnormalities of platelet dense granule ultrastructure in 20 patients with congenital storage pool deficiency

H J Weiss, Bruce Lages, William J. Vicic et al. · British Journal of Haematology · 1993 · 68 citations

Advanced CMOS transistors with a novel HfSiON gate dielectric

Antonio Rotondaro, M. R. Visokay, James J. Chambers et al. · 2003 · 60 citations

Materials Science, Poly Si, Electrical Engineering +13

Morphology of TiO2 Aerogels. 1. Electron Microscopy

Zhu Zhu, Lancy Tsung, Micha Tomkiewicz · The Journal of Physical Chemistry · 1995 · 44 citations

Engineering, Chemical Analysis, Microscopy +18