S. Guillaumet

High performance UTBB FDSOI devices featuring 20nm gate length for 14nm node and beyond

Qianlong Liu, M. Vinet, J. Gimbert et al. · 2013 · 96 citations

Engineering, Computer Engineering, Electrical Engineering +10

Hybrid bonding for 3D stacked image sensors: impact of pitch shrinkage on interconnect robustness

J. Jourdon, S. Lhostis, S. Moreau et al. · 2018 · 84 citations

Engineering, Electrical Engineering, Microelectromechanical Systems +16

1μm Pitch direct hybrid bonding with <300nm wafer-to-wafer overlay accuracy

A. Jouve, V. Balan, N. Bresson et al. · 2017 · 35 citations

Engineering, Materials Science, Electronic Materials +13

UTBB FDSOI scaling enablers for the 10nm node

L. Grenouillet, Qinrang Liu, R. Wacquez et al. · 2013 · 29 citations

Engineering, Computer Engineering, Electrical Engineering +17

FDSOI CMOS devices featuring dual strained channel and thin BOX extendable to the 10nm node

Q. Liu, B. DeSalvo, P. Morin et al. · 2014 · 29 citations

Engineering, Computer Engineering, Electrical Engineering +12